Materials for information technology : devices, interconnects and packaging
The fast-developing information technology industry is driving a need for new materials in order to facilitate the development of more reliable microelectronic products. Materials for Information Technology is an up-to-date overview of current developments and R&D activities in the field of mate...
Tallennettuna:
| Muut tekijät: | , , |
|---|---|
| Aineistotyyppi: | Livre numérique |
| Kieli: | Anglais |
| Julkaistu: |
London :
Springer London
[20..].
Cham : Springer Nature |
| Painos: | 1st ed. 2005. |
| Sarja: | Engineering Materials and Processes
|
| Linkit: | Accès sur la plateforme de l'éditeur Accès sur la plateforme Istex Accès Université d'Orléans Accès INSA CVL |
| Huomautus: |
Archives Springer e-books (Licence nationale) Archives Springer e-books (Licence nationale) |
| Autres localisations: | Voir dans le Sudoc |
| Edition sous un autre format: | • Materials for information technology, devices, interconnects and packaging, Ehrenfried Zschech, Caroline Whelan and Thomas Mikolajick (eds.), London, Springer, 2005, 1 vol. (xix-508 p.), Engineering materials and processes, 1-85233-941-1 |
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| 001 | 948051 | ||
| 008 | 080409q2000 xx ||| |||| 00| 0 eng d | ||
| 009 | PPN123080819 | ||
| 020 | |a 9781846282355 | ||
| 020 | |a 9781846282355 | ||
| 041 | 0 | |a eng | |
| 082 | |a 620 | ||
| 245 | 0 | 0 | |a Materials for information technology : |b devices, interconnects and packaging |c edited by Ehrenfried Zschech, Caroline Whelan, Thomas Mikolajick. |
| 250 | |a 1st ed. 2005. | ||
| 260 | |a London : |b Springer London. | ||
| 260 | |a Cham : |b Springer Nature, |c [20..]. | ||
| 490 | 0 | |a Engineering Materials and Processes |x 2365-0761 | |
| 500 | |a Archives Springer e-books (Licence nationale) | ||
| 500 | |a Archives Springer e-books (Licence nationale) | ||
| 505 | 1 | |a Recent Advances in Thin-film Deposition Molecular-beam Deposition of High-k Gate Dielectrics for Advanced CMOS LEPECVD A Production Technique for SiGe MOSFETs and MODFETs Thin-film Engineering by Atomic-layer Deposition for Ultra-scaled and Novel Devices Atomic-layer Deposited Barrier and Seed Layers for Interconnects Copper CVD for Conformal Ultrathin-film Deposition Pushing PVD to the Limits Recent Advances Surface Engineering Using Self-assembled Monolayers: Model Substrates for Atomic-layer Deposition Selective Airgaps: Towards a Scalable Low-k Solution Silicides Recent Advances and Prospects TEM Characterization of Strained Silicon Material Aspects of Non-Volatile Memories An Introduction to Nonvolatile Memory Technology Floating-dot Memory Transistors on SOI Substrate Ion-beam Synthesis of Nanocrystals for Multidot Memory Structures Scaling of Ferroelectric-based Memory Concepts Device Concepts with Magnetic Tunnel Junctions Phase-change Memories Amorphous-to-fcc Transition in GeSbTe Alloys Organic Nonvolatile Memories Materials for Interconnects Interconnect Technology Today, Recent Advances and a Look into the Future Dielectric and Scaling Effects on Electromigration for Cu Interconnects Texture and Stress Study of Sub-Micron Copper Interconnect Lines Using X-ray Microdiffraction Stress Modeling for Copper Interconnect Structures Conductivity Enhancement in Metallization Structures of Regular Grains Advanced Barriers for Copper Interconnects Synthesis and Characterization of Compounds Obtained by Crosslinking of Polymethylhydrosiloxane by Aromatic Rings Revealing the Porous Structure of Low-k Materials Through Solvent Diffusion Carbon Nanotube Via Technologies for Future LSI Interconnects Nickel Nanowires Obtained by Template Synthesis Materials for Assembly/Packaging The Importance of Polymers in Wafer-Level Packaging Electrically Conductive Adhesives as Solder Alternative: A Feasible Challenge The Role of Au/Sn Solder in Packaging Packaging Materials: Organic-Inorganic Hybrids for Millimetre-Wave Optoelectronics Wafer-Level Three-Dimensional Hyper-Integration Technology Using Dielectric Adhesive Wafer Bonding Advanced Materials Characterization Challenges to Advanced Materials Characterization for ULSI Applications Advanced Material Characterization by TOFSIMS in Microelectronic Electronic Properties of the Interface Formed by Pr2O3 Growth on Si(001), Si(111) and SiC(0001) Surfaces Materials Characterization by Ellipsometry Thermal Desorption Spectrometry as a Method of Analysis for Advanced Interconnect Materials Electron Backscatter Diffraction: Application to Cu Interconnects in Top-View and Cross Section X-ray Reflectivity Characterisation of Thin-Film and Multilayer Structures | |
| 506 | |a Accès en ligne pour les établissements français bénéficiaires des licences nationales | ||
| 506 | |a Accès soumis à abonnement pour tout autre établissement | ||
| 506 | |a Conditions particulières de réutilisation pour les bénéficiaires des licences nationales. https://www.licencesnationales.fr/springer-nature-ebooks-contrat-licence-ln-2017 | ||
| 520 | |a The fast-developing information technology industry is driving a need for new materials in order to facilitate the development of more reliable microelectronic products. Materials for Information Technology is an up-to-date overview of current developments and R&D activities in the field of materials used for information technology with a focus on future applications. Included are: materials for silicon-based semiconductor devices (including high-k gate dielectric materials); materials for nonvolatile memories; materials for on-chip interconnects and interlayer dielectrics (including silicides, barrier materials, low-k and ultra low-k dielectric materials); and materials for assembly and packaging The latest results in materials science and engineering as well as applications in the semiconductor industry are covered including the synthesis of blanket and patterned thin film materials, their properties, constitution, structure and microstructure. Computer modelling and analytical techniques to characterise thin film structures are also included to give a comprehensive survey of materials for the IT industry. The Engineering Materials and Processes series focuses on all forms of materials and the processes used to synthesise and formulate them as they relate to the various engineering disciplines. The series deals with a diverse range of materials: ceramics; metals (ferrous and non-ferrous); semiconductors; composites, polymers, biomimetics etc. Each monograph in the series is written by a specialist and demonstrates how enhancements in materials and the processes associated with them can improve performance in the field of engineering in which they are used | ||
| 700 | 1 | |a Zschech, Ehrenfried. |4 pbd | |
| 700 | 1 | |a Mikolajick, Thomas. |4 pbd | |
| 700 | 1 | |a Whelan, Caroline. |4 pbd | |
| 776 | 0 | |0 124786820 |t Materials for information technology |o devices, interconnects and packaging |f Ehrenfried Zschech, Caroline Whelan and Thomas Mikolajick (eds.) |c London |n Springer |d 2005 |p 1 vol. (xix-508 p.) |s Engineering materials and processes |z 1-85233-941-1 | |
| 856 | 4 | |q PDF |u https://doi.org/10.1007/1-84628-235-7 |z Accès sur la plateforme de l'éditeur | |
| 856 | 4 | |u https://revue-sommaire.istex.fr/ark:/67375/8Q1-HPLCJ1GN-9 |z Accès sur la plateforme Istex | |
| 856 | 4 | |5 452349901:748046011 |u https://ezproxy.univ-orleans.fr/login?url=https://dx.doi.org/10.1007/1-84628-235-7 |z Accès Université d'Orléans | |
| 856 | 4 | |5 180339901:751497126 |u https://ezproxy.insa-cvl.fr/login?qurl=https://dx.doi.org/10.1007/1-84628-235-7 |z Accès INSA CVL | |
| 997 | |0 948051 |1 Livre numérique |a Ressource numérique |b INSA |b ENSA |c 0/Bibliothèque numérique/ |c 1/Bibliothèque numérique/Autre ressource numérique/ | ||