Three dimensional integrated circuit design : EDA, design and microarchitectures
This book presents an overview of the field of 3D IC design, with an emphasis on electronic design automation (EDA) tools and algorithms that can enable the adoption of 3D ICs, and the architectural implementation and potential for future 3D system design. The aim of this book is to provide the read...
Enregistré dans:
| Autres auteurs: | , , |
|---|---|
| Format: | Livre numérique |
| Langue: | Anglais |
| Publié: |
New York, NY :
Springer US
[20..].
Cham : Springer Nature |
| Édition: | 1st ed. 2010. |
| Collection: | Integrated Circuits and Systems
|
| Accès en ligne: | Accès sur la plateforme de l'éditeur Accès sur la plateforme Istex Accès Université d'Orléans Accès INSA CVL |
| Note: |
Archives Springer e-books (Licence nationale) Archives Springer e-books (Licence nationale) |
| Autres localisations: | Voir dans le Sudoc |
| Edition sous un autre format: | • Three-Dimensional Integrated Circuit Design, Texte imprimé, 9781441907851 • Three-Dimensional Integrated Circuit Design, Texte imprimé, 9781461425137 • Three dimensional integrated circuit design, EDA, design and microarchitectures, Yuan Xie, Jason Cong, Sachin Sapatnekar, New York, Springer, 2009, 1 volume (xii-284 pages), Integrated circuits and systems, 978-1-4419-0783-7 |
Table des matières:
- 3D Process Technology Considerations Thermal and Power Delivery Challenges in 3D ICs Thermal-Aware 3D Floorplan Thermal-Aware 3D Placement Thermal Via Insertion and Thermally Aware Routing in 3D ICs Three-Dimensional Microprocessor Design Three-Dimensional Network-on-Chip Architecture PicoServer: Using 3D Stacking Technology to Build Energy Efficient Servers System-Level 3D IC Cost Analysis and Design Exploration.