Three dimensional integrated circuit design : EDA, design and microarchitectures
This book presents an overview of the field of 3D IC design, with an emphasis on electronic design automation (EDA) tools and algorithms that can enable the adoption of 3D ICs, and the architectural implementation and potential for future 3D system design. The aim of this book is to provide the read...
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| Altri autori: | , , |
|---|---|
| Natura: | Livre numérique |
| Lingua: | Anglais |
| Pubblicazione: |
New York, NY :
Springer US
[20..].
Cham : Springer Nature |
| Edizione: | 1st ed. 2010. |
| Serie: | Integrated Circuits and Systems
|
| Accesso online: | Accès sur la plateforme de l'éditeur Accès sur la plateforme Istex Accès Université d'Orléans Accès INSA CVL |
| Nota: |
Archives Springer e-books (Licence nationale) Archives Springer e-books (Licence nationale) |
| Autres localisations: | Voir dans le Sudoc |
| Edition sous un autre format: | • Three-Dimensional Integrated Circuit Design, Texte imprimé, 9781441907851 • Three-Dimensional Integrated Circuit Design, Texte imprimé, 9781461425137 • Three dimensional integrated circuit design, EDA, design and microarchitectures, Yuan Xie, Jason Cong, Sachin Sapatnekar, New York, Springer, 2009, 1 volume (xii-284 pages), Integrated circuits and systems, 978-1-4419-0783-7 |
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| 245 | 0 | 0 | |a Three dimensional integrated circuit design : |b EDA, design and microarchitectures |c edited by Yuan Xie, Jason Cong, Sachin Sapatnekar. |
| 250 | |a 1st ed. 2010. | ||
| 260 | |a New York, NY : |b Springer US. | ||
| 260 | |a Cham : |b Springer Nature, |c [20..]. | ||
| 490 | 0 | |a Integrated Circuits and Systems |x 1558-9420 | |
| 500 | |a Archives Springer e-books (Licence nationale) | ||
| 500 | |a Archives Springer e-books (Licence nationale) | ||
| 505 | 1 | |a 3D Process Technology Considerations Thermal and Power Delivery Challenges in 3D ICs Thermal-Aware 3D Floorplan Thermal-Aware 3D Placement Thermal Via Insertion and Thermally Aware Routing in 3D ICs Three-Dimensional Microprocessor Design Three-Dimensional Network-on-Chip Architecture PicoServer: Using 3D Stacking Technology to Build Energy Efficient Servers System-Level 3D IC Cost Analysis and Design Exploration. | |
| 506 | |a Accès en ligne pour les établissements français bénéficiaires des licences nationales | ||
| 506 | |a Accès soumis à abonnement pour tout autre établissement | ||
| 506 | |a Conditions particulières de réutilisation pour les bénéficiaires des licences nationales. https://www.licencesnationales.fr/springer-nature-ebooks-contrat-licence-ln-2017 | ||
| 520 | |a This book presents an overview of the field of 3D IC design, with an emphasis on electronic design automation (EDA) tools and algorithms that can enable the adoption of 3D ICs, and the architectural implementation and potential for future 3D system design. The aim of this book is to provide the reader with a complete understanding of: the promise of 3D ICs in building novel systems that enable the chip industry to continue along the path of performance scaling, the state of the art in fabrication technologies for 3D integration, the most prominent 3D-specific EDA challenges, along with solutions and best practices, the architectural benefits of using 3D technology, architectural-and system-level design issues, and the cost implications of 3D IC design. Three Dimensional Integrated Circuit Design: EDA, Design and Microarchitectures is intended for practitioners in the field, researchers and graduate students seeking to know more about 3D IC design. | ||
| 700 | 1 | |a Xie, Yuan, |d 19..-...., |c chercheur en informatique. |4 pbd | |
| 700 | 1 | |a Cong, Jingsheng Jason, |d 19..- |4 pbd | |
| 700 | 1 | |a Sapatnekar, Sachin S., |d 1967- |4 pbd | |
| 776 | 0 | |t Three-Dimensional Integrated Circuit Design |b Texte imprimé |z 9781441907851 | |
| 776 | 0 | |t Three-Dimensional Integrated Circuit Design |b Texte imprimé |z 9781461425137 | |
| 776 | 0 | |0 142828564 |t Three dimensional integrated circuit design |o EDA, design and microarchitectures |f Yuan Xie, Jason Cong, Sachin Sapatnekar |c New York |n Springer |d 2009 |p 1 volume (xii-284 pages) |s Integrated circuits and systems |z 978-1-4419-0783-7 | |
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