Copper Interconnect Technology
Since overall circuit performance has depended primarily on transistor properties, previous efforts to enhance circuit and system speed were focused on transistors as well. During the last decade, however, the parasitic resistance, capacitance, and inductance associated with interconnections began t...
Αποθηκεύτηκε σε:
| Κύριος συγγραφέας: | |
|---|---|
| Μορφή: | Livre numérique |
| Γλώσσα: | Anglais |
| Έκδοση: |
New York, NY :
Springer New York
[20..].
Cham : Springer Nature |
| Έκδοση: | 1st ed. 2009. |
| Διαθέσιμο Online: | Accès sur la plateforme de l'éditeur Accès sur la plateforme Istex Accès Université d'Orléans Accès INSA CVL |
| Σημείωση: |
Archives Springer e-books (Licence nationale) Archives Springer e-books (Licence nationale) |
| Autres localisations: | Voir dans le Sudoc |
| Edition sous un autre format: | • Copper Interconnect Technology, Texte imprimé, 9781441900753 |
Πίνακας περιεχομένων:
- Introduction Dielectric Materials Diffusion and Barrier Layer Pattern Generation Deposition Technologies of Materials for Cu-interconnects Copper Damascene Process and Chemical Mechanical Polishing Conduction and Electromigration (EM) Routing and Reliability