Copper Interconnect Technology
Since overall circuit performance has depended primarily on transistor properties, previous efforts to enhance circuit and system speed were focused on transistors as well. During the last decade, however, the parasitic resistance, capacitance, and inductance associated with interconnections began t...
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| Glavni autor: | |
|---|---|
| Format: | Livre numérique |
| Jezik: | Anglais |
| Izdano: |
New York, NY :
Springer New York
[20..].
Cham : Springer Nature |
| Izdanje: | 1st ed. 2009. |
| Online pristup: | Accès sur la plateforme de l'éditeur Accès sur la plateforme Istex Accès Université d'Orléans Accès INSA CVL |
| Bilješka: |
Archives Springer e-books (Licence nationale) Archives Springer e-books (Licence nationale) |
| Autres localisations: | Voir dans le Sudoc |
| Edition sous un autre format: | • Copper Interconnect Technology, Texte imprimé, 9781441900753 |
| LEADER | 03236nam a22003257a 4500 | ||
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| 001 | 942604 | ||
| 008 | 110106q2000 xx ||| |||| 00| 0 eng d | ||
| 009 | PPN149043619 | ||
| 020 | |a 9781441900760 | ||
| 020 | |a 9781441900760 | ||
| 041 | 0 | |a eng | |
| 082 | |a 621.381 | ||
| 100 | 1 | |a Gupta, Tapan. | |
| 245 | 1 | 0 | |a Copper Interconnect Technology |c by Tapan Gupta. |
| 250 | |a 1st ed. 2009. | ||
| 260 | |a New York, NY : |b Springer New York. | ||
| 260 | |a Cham : |b Springer Nature, |c [20..]. | ||
| 500 | |a Archives Springer e-books (Licence nationale) | ||
| 500 | |a Archives Springer e-books (Licence nationale) | ||
| 505 | 1 | |a Introduction Dielectric Materials Diffusion and Barrier Layer Pattern Generation Deposition Technologies of Materials for Cu-interconnects Copper Damascene Process and Chemical Mechanical Polishing Conduction and Electromigration (EM) Routing and Reliability | |
| 506 | |a Accès en ligne pour les établissements français bénéficiaires des licences nationales | ||
| 506 | |a Accès soumis à abonnement pour tout autre établissement | ||
| 506 | |a Conditions particulières de réutilisation pour les bénéficiaires des licences nationales. https://www.licencesnationales.fr/springer-nature-ebooks-contrat-licence-ln-2017 | ||
| 520 | |a Since overall circuit performance has depended primarily on transistor properties, previous efforts to enhance circuit and system speed were focused on transistors as well. During the last decade, however, the parasitic resistance, capacitance, and inductance associated with interconnections began to influence circuit performance and will be the primary factors in the evolution of nanoscale ULSI technology. Because metallic conductivity and resistance to electromigration of bulk copper (Cu) are better than aluminum, use of copper and low-k materials now prevails in the international microelectronics industry. However, as the feature size of the Cu-lines forming interconnects is scaled, resistivity of the lines increases. At the same time electromigration and stress-induced voids due to increased current density become significant reliability issues. Although copper/low-k technology has become fairly mature, there is no single book available on the promise and challenges of these next-generation technologies. In this book, a leader in the field describes advanced laser systems with lower radiation wavelengths, photolithography materials, and mathematical modeling approaches to address the challenges of Cu-interconnect technology | ||
| 776 | 0 | |t Copper Interconnect Technology |b Texte imprimé |z 9781441900753 | |
| 856 | 4 | |q PDF |u https://doi.org/10.1007/978-1-4419-0076-0 |z Accès sur la plateforme de l'éditeur | |
| 856 | 4 | |u https://revue-sommaire.istex.fr/ark:/67375/8Q1-VR7KXV0G-9 |z Accès sur la plateforme Istex | |
| 856 | 4 | |5 452349901:747839352 |u https://ezproxy.univ-orleans.fr/login?url=https://dx.doi.org/10.1007/978-1-4419-0076-0 |z Accès Université d'Orléans | |
| 856 | 4 | |5 180339901:750856866 |u https://ezproxy.insa-cvl.fr/login?qurl=https://dx.doi.org/10.1007/978-1-4419-0076-0 |z Accès INSA CVL | |
| 997 | |0 942604 |1 Livre numérique |a Ressource numérique |b INSA |b ENSA |c 0/Bibliothèque numérique/ |c 1/Bibliothèque numérique/Autre ressource numérique/ | ||