3-Dimensional VLSI : A 2.5-Dimensional integration scheme
"3-Dimensional VLSI: A 2.5-Dimensional Integration Scheme"elaborates the concept and importance of 3-Dimensional (3-D) VLSI. The authors have developed a new 3-D IC integration paradigm, so-called 2.5-D integration, to address many problems that are hard to resolve using traditional non-mo...
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| Autors principals: | , |
|---|---|
| Format: | Livre numérique |
| Idioma: | Anglais |
| Publicat: |
Berlin, Heidelberg :
Springer Berlin Heidelberg
2010.
Cham : Springer Nature |
| Accés en línia: | Accès sur la plateforme de l'éditeur Accès sur la plateforme Istex Accès Université d'Orléans Accès INSA CVL |
| Nota: |
Archives Springer e-books (Licence nationale) Archives Springer e-books (Licence nationale) |
| Autres localisations: | Voir dans le Sudoc |
| Edition sous un autre format: | • 3-Dimensional VLSI, Texte imprimé, 9783642041563 • 3-Dimensional VLSI, Texte imprimé, 9783642041785 |
| LEADER | 02966nam a22003257a 4500 | ||
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| 008 | 110106s2010 xx ||| |||| 00| 0 eng d | ||
| 009 | PPN149026420 | ||
| 020 | |a 9783642041570 | ||
| 041 | 0 | |a eng | |
| 082 | |a 621.3815 | ||
| 100 | 1 | |a Deng, Yangdong. | |
| 245 | 1 | 0 | |a 3-Dimensional VLSI : |b A 2.5-Dimensional integration scheme |c by Yangdong Deng, Wojciech P. Maly. |
| 260 | |a Berlin, Heidelberg : |b Springer Berlin Heidelberg. | ||
| 260 | |a Cham : |b Springer Nature, |c 2010. | ||
| 500 | |a Archives Springer e-books (Licence nationale) | ||
| 500 | |a Archives Springer e-books (Licence nationale) | ||
| 505 | 0 | |a A Cost Comparison of VLSI Integration Schemes -- Design Case Studies -- An Automatic 2.5-D Layout Design Flow -- Floorplanning for 2.5-D Integration -- Placement for 2.5-D Integration -- A Road map of 2.5-D Integration -- Conclusion and Future Work. | |
| 506 | |a Accès en ligne pour les établissements français bénéficiaires des licences nationales | ||
| 506 | |a Accès soumis à abonnement pour tout autre établissement | ||
| 506 | |a Conditions particulières de réutilisation pour les bénéficiaires des licences nationales. chttps://www.licencesnationales.fr/springer-nature-ebooks-contrat-licence-ln-2017 | ||
| 520 | |a "3-Dimensional VLSI: A 2.5-Dimensional Integration Scheme"elaborates the concept and importance of 3-Dimensional (3-D) VLSI. The authors have developed a new 3-D IC integration paradigm, so-called 2.5-D integration, to address many problems that are hard to resolve using traditional non-monolithic integration schemes. The book also introduces major 3-D VLSI design issues that need to be solved by IC designers and Electronic Design Automation (EDA) developers. By treating 3-D integration in an integrated framework, the book provides important insights for semiconductor process engineers, IC designers, and those working in EDA R&D. Dr. Yangdong Deng is an associate professor at the Institute of Microelectronics, Tsinghua University, China. Dr. Wojciech P. Maly is the U. A. and Helen Whitaker Professor at the Department of Electrical and Computer Engineering, Carnegie Mellon University, USA. | ||
| 700 | 1 | |a Maly, Wojciech P. |4 aut | |
| 776 | 0 | |t 3-Dimensional VLSI |b Texte imprimé |z 9783642041563 | |
| 776 | 0 | |t 3-Dimensional VLSI |b Texte imprimé |z 9783642041785 | |
| 856 | 4 | |q PDF |u https://doi.org/10.1007/978-3-642-04157-0 |z Accès sur la plateforme de l'éditeur | |
| 856 | 4 | |u https://revue-sommaire.istex.fr/ark:/67375/8Q1-HXRXBF01-4 |z Accès sur la plateforme Istex | |
| 856 | 4 | |5 452349901:747834520 |u https://ezproxy.univ-orleans.fr/login?url=https://doi.org/10.1007/978-3-642-04157-0 |z Accès Université d'Orléans | |
| 856 | 4 | |5 180339901:750852038 |u https://ezproxy.insa-cvl.fr/login?qurl=https://doi.org/10.1007/978-3-642-04157-0 |z Accès INSA CVL | |
| 997 | |0 942279 |1 Livre numérique |a Ressource numérique |b INSA |b ENSA |c 0/Bibliothèque numérique/ |c 1/Bibliothèque numérique/Autre ressource numérique/ | ||

