Mechanics of Microelectronics
From a mechanical engineering point of view, Microelectronics and Microsystems are multi-scale in both geometric and time domains, multi-process, multi-functionality, multi-disciplinary, multi-material/interface, multi-damage and multi-failure mode. Their responses in manufacturing, assembling, qual...
Kaydedildi:
| Yazar: | |
|---|---|
| Diğer Yazarlar: | , |
| Materyal Türü: | Livre numérique |
| Dil: | Anglais |
| Baskı/Yayın Bilgisi: |
Dordrecht :
Springer Netherlands
[20..].
Cham : Springer Nature |
| Edisyon: | 1st ed. 2006. |
| Seri Bilgileri: | Solid Mechanics and Its Applications
141 |
| Online Erişim: | Accès sur la plateforme de l'éditeur Accès sur la plateforme Istex Accès Université d'Orléans Accès INSA CVL |
| Not: |
Archives Springer e-books (Licence nationale) Archives Springer e-books (Licence nationale) |
| Autres localisations: | Voir dans le Sudoc |
| Edition sous un autre format: | • Mechanics of microelectronics, par G.Q. Zhang,... W.D. van Driel,... et X.J. Fan,..., Dordrecht, The Netherlands, Springer, 2006, 1 vol. (XIII-563 p.), Solid mechanics and its applications, 1-402-04934-X |
İçindekiler:
- Microelectronics Technology Reliability Practice Thermal Management to Advanced Mechanics Thermo-Mechanics of Integrated Circuits and Packages Characterization and Modelling of Moisture Behaviour Characterization and Modelling of Solder Joint Reliability Virtual Thermo-Mechanical Prototyping Challenges and Future Perspectives