Mechanics of Microelectronics
From a mechanical engineering point of view, Microelectronics and Microsystems are multi-scale in both geometric and time domains, multi-process, multi-functionality, multi-disciplinary, multi-material/interface, multi-damage and multi-failure mode. Their responses in manufacturing, assembling, qual...
Enregistré dans:
| 主要作者: | |
|---|---|
| 其他作者: | , |
| 格式: | Livre numérique |
| 語言: | Anglais |
| 出版: |
Dordrecht :
Springer Netherlands
[20..].
Cham : Springer Nature |
| 版: | 1st ed. 2006. |
| 叢編: | Solid Mechanics and Its Applications
141 |
| 在線閱讀: | Accès sur la plateforme de l'éditeur Accès sur la plateforme Istex Accès Université d'Orléans Accès INSA CVL |
| 提示: |
Archives Springer e-books (Licence nationale) Archives Springer e-books (Licence nationale) |
| Autres localisations: | Voir dans le Sudoc |
| Edition sous un autre format: | • Mechanics of microelectronics, par G.Q. Zhang,... W.D. van Driel,... et X.J. Fan,..., Dordrecht, The Netherlands, Springer, 2006, 1 vol. (XIII-563 p.), Solid mechanics and its applications, 1-402-04934-X |
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| 100 | 1 | |a Zhang, G. Q. | |
| 245 | 1 | 0 | |a Mechanics of Microelectronics |c edited by G. Q. Zhang, W. D. Driel, X. J. Fan. |
| 250 | |a 1st ed. 2006. | ||
| 260 | |a Dordrecht : |b Springer Netherlands. | ||
| 260 | |a Cham : |b Springer Nature, |c [20..]. | ||
| 490 | 0 | |a Solid Mechanics and Its Applications |v 141 |x 2214-7764 | |
| 500 | |a Archives Springer e-books (Licence nationale) | ||
| 500 | |a Archives Springer e-books (Licence nationale) | ||
| 505 | 1 | |a Microelectronics Technology Reliability Practice Thermal Management to Advanced Mechanics Thermo-Mechanics of Integrated Circuits and Packages Characterization and Modelling of Moisture Behaviour Characterization and Modelling of Solder Joint Reliability Virtual Thermo-Mechanical Prototyping Challenges and Future Perspectives | |
| 506 | |a Accès en ligne pour les établissements français bénéficiaires des licences nationales | ||
| 506 | |a Accès soumis à abonnement pour tout autre établissement | ||
| 506 | |a Conditions particulières de réutilisation pour les bénéficiaires des licences nationales. https://www.licencesnationales.fr/springer-nature-ebooks-contrat-licence-ln-2017 | ||
| 520 | |a From a mechanical engineering point of view, Microelectronics and Microsystems are multi-scale in both geometric and time domains, multi-process, multi-functionality, multi-disciplinary, multi-material/interface, multi-damage and multi-failure mode. Their responses in manufacturing, assembling, qualification tests and application conditions are strongly nonlinear and stochastic. Mechanics of Microelectronics is extremely important and challenging, in terms of both industrial applications and academic research. Written by the leading experts with both profound knowledge and rich practical experience in advanced mechanics and microelectronics industry, this book aims to provide the cutting edge knowledge and solutions for various mechanical related problems, in a systematic way. It contains essential and detailed information about the state-of-the-art theories, methodologies, the way of working and real case studies | ||
| 700 | 1 | |a Van Driel, Willem Dirk, |d 19..- |4 pbd | |
| 700 | 1 | |a Fan, Xuejun, |d 19..- |4 pbd | |
| 776 | 0 | |0 110803841 |t Mechanics of microelectronics |f par G.Q. Zhang,... W.D. van Driel,... et X.J. Fan,... |c Dordrecht, The Netherlands |n Springer |d 2006 |p 1 vol. (XIII-563 p.) |s Solid mechanics and its applications |z 1-402-04934-X | |
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