Bonding in Microsystem Technology
Bonding in Microsystem Technology starts with descriptions of terminology, kinds of microsystems and market analysis. Followed by the presentation of mechanisms of wet etching, set of process parameters, description of micromachining methods, examples of procedures, process flow-charts and applicati...
Gespeichert in:
| 1. Verfasser: | |
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| Format: | Livre numérique |
| Sprache: | Anglais |
| Veröffentlicht: |
Dordrecht :
Springer Netherlands
[20..].
Cham : Springer Nature |
| Schriftenreihe: | Springer Series in Advanced Microelectronics
24 |
| Online Zugang: | Accès sur la plateforme de l'éditeur Accès sur la plateforme Istex Accès Université d'Orléans Accès INSA CVL |
| Anmerkung: |
Archives Springer e-books (Licence nationale) Archives Springer e-books (Licence nationale) |
| Autres localisations: | Voir dans le Sudoc |
| Edition sous un autre format: | • Bonding in microsystem technology, J.A. Dziuban, [Dordrecht], Springer, 2006, 1 vol. (XVIII-331 p.), Springer series in advanced microelectronics, 1-402-04578-6 |
Inhaltsangabe:
- Some Remarks on Microsystem Systematics and Development Deep, Three-Dimensional Silicon Micromachining Bonding Classification of Bonding and Closing Remarks