Bonding in Microsystem Technology
Bonding in Microsystem Technology starts with descriptions of terminology, kinds of microsystems and market analysis. Followed by the presentation of mechanisms of wet etching, set of process parameters, description of micromachining methods, examples of procedures, process flow-charts and applicati...
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| Главный автор: | |
|---|---|
| Формат: | Livre numérique |
| Язык: | Anglais |
| Опубликовано: |
Dordrecht :
Springer Netherlands
[20..].
Cham : Springer Nature |
| Серии: | Springer Series in Advanced Microelectronics
24 |
| Online-ссылка: | Accès sur la plateforme de l'éditeur Accès sur la plateforme Istex Accès Université d'Orléans Accès INSA CVL |
| Примечание: |
Archives Springer e-books (Licence nationale) Archives Springer e-books (Licence nationale) |
| Autres localisations: | Voir dans le Sudoc |
| Edition sous un autre format: | • Bonding in microsystem technology, J.A. Dziuban, [Dordrecht], Springer, 2006, 1 vol. (XVIII-331 p.), Springer series in advanced microelectronics, 1-402-04578-6 |
| LEADER | 03018nam a22003257a 4500 | ||
|---|---|---|---|
| 001 | 938122 | ||
| 008 | 080410q2000 xx ||| |||| 00| 0 eng d | ||
| 009 | PPN123115019 | ||
| 020 | |a 9781402045899 | ||
| 020 | |a 9781402045899 | ||
| 041 | 0 | |a eng | |
| 082 | |a 620.1 | ||
| 100 | 1 | |a Dziuban, Jan A. | |
| 245 | 1 | 0 | |a Bonding in Microsystem Technology |c by Jan A. Dziuban. |
| 260 | |a Dordrecht : |b Springer Netherlands. | ||
| 260 | |a Cham : |b Springer Nature, |c [20..]. | ||
| 490 | 0 | |a Springer Series in Advanced Microelectronics |v 24 |x 1437-0387 | |
| 500 | |a Archives Springer e-books (Licence nationale) | ||
| 500 | |a Archives Springer e-books (Licence nationale) | ||
| 505 | 1 | |a Some Remarks on Microsystem Systematics and Development Deep, Three-Dimensional Silicon Micromachining Bonding Classification of Bonding and Closing Remarks | |
| 506 | |a Accès en ligne pour les établissements français bénéficiaires des licences nationales | ||
| 506 | |a Accès soumis à abonnement pour tout autre établissement | ||
| 506 | |a Conditions particulières de réutilisation pour les bénéficiaires des licences nationales. https://www.licencesnationales.fr/springer-nature-ebooks-contrat-licence-ln-2017 | ||
| 520 | |a Bonding in Microsystem Technology starts with descriptions of terminology, kinds of microsystems and market analysis. Followed by the presentation of mechanisms of wet etching, set of process parameters, description of micromachining methods, examples of procedures, process flow-charts and applications of basic micromechanical structures in microsystems are shown. Next, high-temperature, low temperature and room-temperature bonding and their applications in microsystem technology are presented. The following part of the book contains the detailed description of anodic bonding, starting from analysis of properties of glasses suitable for anodic bonding, and discussion of the nature of the process. Next all types of anodic bonding and sealing procedures used in microsystem technology are presented. This part of the book finishes with examples of applications of anodic bonding in microsystem technology taken from the literature but mainly based on the author s personal experience | ||
| 776 | 0 | |0 107957914 |t Bonding in microsystem technology |f J.A. Dziuban |c [Dordrecht] |n Springer |d 2006 |p 1 vol. (XVIII-331 p.) |s Springer series in advanced microelectronics |z 1-402-04578-6 | |
| 856 | 4 | |q PDF |u https://doi.org/10.1007/1-4020-4589-1 |z Accès sur la plateforme de l'éditeur | |
| 856 | 4 | |u https://revue-sommaire.istex.fr/ark:/67375/8Q1-VDTHLZX7-R |z Accès sur la plateforme Istex | |
| 856 | 4 | |5 452349901:747903026 |u https://ezproxy.univ-orleans.fr/login?url=https://doi.org/10.1007/1-4020-4589-1 |z Accès Université d'Orléans | |
| 856 | 4 | |5 180339901:750916133 |u https://ezproxy.insa-cvl.fr/login?qurl=https://doi.org/10.1007/1-4020-4589-1 |z Accès INSA CVL | |
| 997 | |0 938122 |1 Livre numérique |a Ressource numérique |b INSA |b ENSA |c 0/Bibliothèque numérique/ |c 1/Bibliothèque numérique/Autre ressource numérique/ | ||